Consumer Electronics Industry
- Precision Marking
- Welding
- Cutting
Laser Applications
New Energy Automotive Industry
- Batteries
- Motors
- Automotive Electronics
Packaging Traceability
- Food
- Medical
- Tabaco
Semiconductor Industry
- Wafer marking
- Dicing
- IC marking
- Plasma cleaning
- AOI
Consumer Electronics
Earphone
- Soldering Paste
- Solder Ball Soldering
- Laser markin
Optical Instrument
- Laser marking
- Laser cutting
- Laser etching
Smart Home
- Laser marking
Computer
- Laser marking
- Laser welding
- Laser cutting
Accessories
- Laser marking
- Laser soldering
Wearable Device
- Laser cleaning
- Deep carving on the Back cover
- Glass cutting
- Groove Mark
Electronic Components
- Laser marking
- Laser soldering
- PCB/FPC cutting
VR
- 3D surface marker
- Laser cutting
- PC plastic welding
- Glass cutting
Laser Marking
- Surface Black Mark
- Deep Engraving
- Micro-holes
- Laser Removal (Adhesive / PVD Coating)
- Bar Code / Matrix Traceback
- 3D Marker
Laser Welding
- Metal Welding
- Dissimilar Metal Welding
- Plastic Welding
- Fusion Soldering / Solder Ball Jet Soldering
- High Power Welding
Laser Cutting
- PCB/FPCB Cutting
- Brittle Material Cutting
- Wafer Laser Cutting
- PC Precision Cutting
- Metal Precision Cutting
- High Power Cutting
Semiconductor
In the semiconductor industry, we have launched some industry-specific standard equipment, including IC , wafer, PCB marking, Sip/FPC/PCB cutting, plasma cleaning, and we also provide AOI automatic optical inspection solutions for the semiconductor industry. The technical threshold of the semiconductor industry is relatively high, which is more representative of our technical strength. We continue to invest in research and development in all fields such as wafer marking and advanced packaging in the semiconductor industry.
Laser Application System
1. Laser Marking System
- IC Mark ( Substrate , L/F )
- PCB Marking
- Wafer Mark ( ID , Die )
2. Laser Cutting System
- Sip , FPC , PCB Cutting
- Glass, Ceramic, Sapphire Cutting
- Low-k Wafer Slotting
- Sic Wafer Cutting
3. Laser De-flash System
Plasma Application System
1. Plasma Cleaning System
- RF Plasma Cleaning (Online, Cavity)
- MW Plasma Cleaning (Online, Cavity)
AOI Solution
2. AOI Automatic
- IC Marking Defect Detection
- Die Bonding Defect Detection
- Appearance Inspection Before Shipment ( T2T , R2R )
Laser Slotting
