BRITTLE MATERIAL DOUBLE HEAD
Precision Laser Precision Cutting Machines
The cutting devices researched and developed for transparent brittle materials consist of picosecond laser cutting, CO2 laser splitting and automatic material loading and unloading. The picosecond laser beams pass through laser shredding cutting heads focusing on materials for perforation, and coordinate with X/Y high speed platforms to move at the highest speed to 300mm/s to form the required cutting lines. CO2 laser is used to heat the cutting lines. The principle of expansion on heating and contraction on cooling is used to actually seperate products with wastes quickly. After seperation, the edge breakage of the products is at <5um, and strength is even higher. They are especially suitable to cutting on transparent brittle materials such as sapphire, toughened or non-toughened glass.